AWA DecTec™ Europe Labeling & Package Decorating Technologies Seminar 2013: EMPACK 2013 visitors receive an in-depth insight into the world of labels

Wednesday, February 27, 2013

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AWA Alexander Watson Associates and easyFairs are co-operating to provide visitors to packaging tradeshow EMPACK 2013, March 27-28, 's Hertogenbosch, The Netherlands, with a holistic insight into the world of labels, labeling technologies, and related innovations.

The AWA DecTec™ Europe Labeling & Package Decorating Technologies Seminar 2013 takes place on Wednesday March 27 during EMPACK 2013.

Reviewing label markets and assessing labeling technologies

The program provides seminar delegates with the opportunity to increase and update their knowledge of labeling markets and decoration technologies -- in only six hours. Dr William Llewellyn, Vice President and Senior Consultant at AWA Alexander Watson Associates, will open the seminar with an overview of the labeling and decoration markets, looking at market shares and volumes by geography, market segment, technology, and end-use application.

A comparison of the main labeling technologies -- pressure-sensitive, in-mold, sleeving, and glue-applied -- will be provided by Jack van der Hoeven, Sales and Marketing Manager at label printer CCL Label Oss. The program then provides an understanding of why a particular decoration technology would be chosen for a particular labeling task. Hans Poortinga, Proprietor, IML Experts, gives his perspective, as a converter, on the use of digital print technology for labels and package decoration; and, in a complementary presentation, Clayton Sampson will highlight what direct-to-product inkjet printing means for plastic component/package decoration. He is the Managing Director of Cyan Tec, and a frequent speaker on this developing technology for the sector.

Added value for labels and packaging

A label is more than just a pretty decoration, as René Goossens, Managing Director of Leonhard Kurz Benelux demonstrates in his paper on the security features and functionalities which can be added to a label and packaging.

Networking and reception

After the seminar, participants have the opportunity to visit EMPACK and attend the networking reception.

Full details of the program can be found on the AWA website, click here.

Registration for the seminar can also be accomplished online, click here

For further information on EMPACK 2013, click here

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