Polyonics Polyimide Label Material Meets ASTM E595 Out-Gassing Requirements

Friday, March 14, 2014

imagePolyonics has introduced a new high temperature label material that meets the stringent ASTM E595 out-gassing requirements.  Along with minimal out-gassing, the new label material, XF-528 will also survive the high temperature exposure and chemical attacks typically used in the manufacturing process for printed circuit boards.

Out-gassing is a critical issue in the manufacturer and operation of specialized electronic devices such as optical devices and hard disk drives.  These devices are used in a high vacuum environment so the slightest amount of out-gas can be detrimental to their performance.  When materials out-gas, they can leave residue on key components that are sensitive to low levels of deposition.

To make sure materials used in fabrication of these devices are low-outgassing, materials must meet the requirements of ASTM E595 standard.  Along with hard disk manufacturers, NASA and ESA (European Space Agency) also require low out-gassing materials, including labels, be used throughout their spacecrafts.  Any out-gassing can potentially condense onto optical elements, thermal radiators and/or solar cells and obscure them.

Polyonics XF-528 is a 1 mil gloss white label material with a 1 mil solvent acrylic pressure sensitive adhesive.  The ASTM E595 test  results for the XF-528 met the requirement for total mass loss (TML) of less than 1.00% when evaluated in a vacuum environment for a duration of 24 hours at 125C.

The XF-528 is  a robust thermal transfer printable label material that complies with the requirements of RoHS, REACH and is certified to be halogen free to the IEC 61249-2-21 levels.  It can be used in several applications including:

  • Barcode tracking of printed circuit boards
    Electronic component identification
    Warning labels for embedded batteries

Source. www.polyonics.com

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